XPS分析微波等离子体处理的PTFE/陶瓷复合介质材料表面成分

XPS Studies of the Microwave Plasma Modified Teflon/Ceramic Complex Dielectrics

采用不同气氛等离子体处理ＰＴＦＥ／陶瓷复合介质材料，利用ＸＰＳ分析了处理样品表面成分的变化，发现等离子体处理导致表面Ｆ的含量降低和Ｏ的含量增加。高分子表面出现了不同成分的含氧基因，且随着时间的增加，微波功率的增大，一ＣＦ２基团减少，含氧基团增加，这表明不同气氛等离子体与 ＰＴ－ＦＥＣ表面的作用是刻蚀、脱氟、交联和氧化同时并存，其中以氧等离子体刻蚀最为严重。

The Teflon/ceramic complex dielectric (PTFEC),which was modified by using different types of microwave plasma,was studied with X-ray photoelectron spectroscopy. Our results show that the plasma treatment may significantly change the surface chemical concentrations of the material. On the he surface the oxygen contents increases, whereas the fluorine contents decreases. As the microwave plasma power and the plasma modification time increase the concentration of the oxe-group was found to increase, but one type of - CF2 group was found to decrease. Such observation indicate that the vacuous types of plasma modification involves quite a few interactions, such as, simultaneous etching, defluorination, cross-linking and oxidation. The oxygen plasma etching plays a dominant role in plasma modification of the materials.