摘要
文章综述了目前LCM的几种构装技术,并以列表的形式对其各项指标进行了比较,最后得出结论:FinePitch导通技术是未来研究的重点。
This paper in the form of summary,introduces several packaging technologies of LCM, and compared their indicators in the form of a list. Finally make a conclusion： Fine Pitch conduction technology is the focus of future research.
出处
《现代显示》
2010年第11期30-34,共5页
Advanced Display
