摘要
在高温高压条件下（5.2-5.6 GPa,1350℃-1450℃）,以镍基合金为烧结助剂采用熔渗法制备了金刚石复合片（PDC）。采用SEM考察了不同金刚石微粉粒径制备的金刚石复合片中金刚石聚晶（PCD）的组织形貌。通过Raman光谱利用静水压应力模型表征了PCD层表面应力。结果表明,PCD层形成了致密的交错生长结构;PCD层表面残余应力表现为压应力并随着初始金刚石微粉粒径的增大而增大,其值为0.12-0.22GPa。
Polycrystalline diamond compact（PDC） was prepared by infiltration method with nickel-based alloy as solvent under high temperature and high pressure （5.2～6.0GPa,1350℃～1450℃）.Scanning electron microscopy（SEM） was used to observe the micro morphology of polycrystalline diamond（PCD） layer.Raman spectroscopy was used to characterize the residual stress of PCD layer surface by hydrostatic stress model.It was found that dense and interlaced microstructure has formed in PCD layer.The residual stress of PCD layer is a compressive in the range from 0.12 GPa to 0.22 GPa,which increases with the diamond crystal size increasing.
出处
《超硬材料工程》
CAS
2010年第4期21-23,共3页
Superhard Material Engineering
关键词
镍基
PCD
金刚石
形貌
应力
infiltration method
polycrystalline diamond（PCD）
morphology
residual stress
