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挠性印制板拐角防撕裂结构信号传输性能分析

Signal Performance Analysis of Corner Anti-tear Structures on FPC
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摘要 挠性印制板很容易在大应力的作用下造成开裂或断裂,在设计时常在拐角处采用抗撕裂结构设计以更好地改善FPC的抗撕裂的性能。文中基于三维电磁场仿真软件HFSS,对多种圆弧拐角防撕裂结构的信号传输性能及电磁场分布进行了仿真分析,总结了防撕裂结构对高速电路信号传输性能的影响规律。 The FPC easily cracks or breaks under the influence of large stresses.An anti-tear structure is,therefore,used around the corner to better improve the anti-tear performance of FPC.The paper carries out a comprehensive study of various FPC corners' anti-tear structures using a full-wave electromagnetic simulator HFSS.The impact of multiple arc corners' anti-tear structures on SI and the cross-section electromagnetic field is analyzed by modelling and simulation,and the influence of various FPC corners' anti-tear structures on the transmission of high speed circuit signals is summarized.
出处 《电子科技》 2010年第11期55-58,共4页 Electronic Science and Technology
基金 广西自然科学基金资助项目(桂科自0832242) 广西制造系统与先进制造技术重点实验室主任课题资助项目(桂科能0842006_016_Z) 广西研究生教育创新计划资助项目(2008105950802M404 2009105950802M05)
关键词 挠性印制板 信号完整性 拐角防撕裂结构 flexible printed circuit signal integrity corners anti-tear structures
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参考文献5

  • 1路宏敏,安晋元,赵益民,朱满座.印制线拐角的频域分析[J].西安交通大学学报,2007,41(12):1451-1454. 被引量:6
  • 2梁瑞林.挠性印制板[M].北京:科学出版社,2008.
  • 3BOGATION E.信号完整性分析[M].李玉山,李丽平译.北京:电子工业出版社,2005.
  • 4Ansoft Corporation. HFSS Full Book [ M ]. USA: Ansoft Corporation, 2005.
  • 5Eric Bogatin. Signal Integrity : Simplified [ M ].北京:电子工业出版社,2004.

二级参考文献10

  • 1Bogatin E. Signal integrity: simplified[M]. Upper Saddle River, USA:Prentice Hall, 2004.
  • 2Johnson H,Graham M. High-speed digital design: a handbook of black magic[M]. New York: Pearson Education Inc. , 1993.
  • 3Montrose M L EMC and the PCB: design, theory and layout made simple[M]. Piscataway, USA:IEEE Press, 1998.
  • 4Feix N, Lalande M, Jecko B. Harmonic characterization of a micro-strip bend via the finite difference time domain method [J]. IEEE Transactions on Micro- wave Theory and Techniques, 1992, 40(5) : 955-961.
  • 5Douvilie J P, James D S. Experiment study of symmetric micro-strip bends and their compensation[J]. IEEE Transactions on Microwave Theory and Techniques, 1978, 26(3): 175-182.
  • 6Montrose M. Time and frequency domain analysis for right angle corners on printed circuit board traces [C]// Proceedings of IEEE International Symposium on Electromagnetic Compatibility. Piscataway, USA: IEEE, 1998: 551-556.
  • 7Kergonou G, Drissi M, Zak T, et al. Frequency dependence in high speed interconnection[C]// Proceedings of IEEE International Symposium on Electromagnetic Compatibility. Piscataway, USA: IEEE, 2001: 632-634.
  • 8Silvester P, Benedek P. Micro-strip discontinuity capacitances for right-angle bend, T junctions, and crossings[J]. IEEE Transactions on Microwave Theory and Techniques, 1973, 21(5): 341-346.
  • 9Brooks D. Signal integrity issues and printed circuit board design [M]. Upper Saddle River, USA: Prentice Hall, 2003.
  • 10Kodali V P. Engineering electromagnetic compatibility: principles, measurements, technologies, and computer models[M]. 2nd ed. New York: Wiley Publishing Inc. , 2001.

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