摘要
大规模和超大规模集成电路(LSI/VLSI)在飞行器中得到了日益广泛的应用,有效减小了电子设备的体积、增强了飞行器系统的性能,但同时给系统抗电磁脉冲(EMP)辐射效应的可靠性带来了一定的风险。通过对飞行器进行EMP耦合途径分析,本文给出了电磁脉冲环境耦合到电子设备内部集成电路上的主要途径,并通过针对典型的CPU板进行的电磁脉冲辐照试验,证明CPU抗EMP耦合的能力弱于存储器及其它集成电路,得到了CPU板电磁辐照导致"死机"场强的临界值。
The large scale integrated circuit and very large scale integrated circuit（LSI/VLSI） are progressively applied to aerocraft.The size of cubage of electronic equipments is reduced and the performance of aerocraft is enhanced by applying the LSI/VLSI,however the hazard is brought in to lower the reliability of system anti-EMP ability.Through the analysis of aerocraft,the main coupling approach of EMP coupling to inner circuit is introduced.Due to the accomplishment of an experiment for CPU board under limited electromagnetic pulse radicalization,the ability of anti-EMP coupling of CPU is proven weaker than the other circuits and the critical field intensity value while CPU crashes is gained.
出处
《航天控制》
CSCD
北大核心
2010年第5期89-92,共4页
Aerospace Control
关键词
大规模集成电路
电子设备
耦合效应
CPU
Large scale integrated circuit
Electronic equipment
Coupling effects
CPU
