4CARRASS A,JAECKLINV P.Analytical methods to characterize the interconnection quality of gold ball bonds[c]//Proc of the 2nd Euro Conf Elect Packag Technol Eupac96.Essen,Germany,1996:135-139.
5MAYER M.Mieroelectronie bonding process monitoring by integrated sensors[M].Konstanz:Hartung-Gorre Verlag.2000.
6MAYERM,PAULO,BOLLIGER D,et al.Integrated temperature microscnsors for characterization and optimization of therm osonic ball bonding process[J].IEEE Trans on Components and Packaging Technology,2000,23(2):393-398.
7RAMMINGER S,SELIGER N.WACHUTKA G.Reliability model for Al wire bonds subjected to heel crackfailures[J].Microelectronics Reliability,2000,40(10):1521-1525.
8WEINER J A,CLATTERBAUGH G V,CHARLESH K J,et al.Gold ball bond shear strength efects of cleaning metallization and bonding parameters[C]//Proc of the 33rd Elect Comp Conf ECC'83.Orlando,USA,1983:208-220.
9AGUILAM T,FELIPER C,VELARD A F,et al.Ball bond characterization:all intensive analysis on ball size and shear experiment results and applicability to existing standards[C]//Proc of the 1st Elect Package Technol Conf EPTC'97.Singapore,1997:46-51.
