焊膏触变性对印刷质量的影响

Thixotropy of Soldering Paste Influences Printing Quality

分析了焊膏触变性对印刷质量产生影响的原因和过程,并从焊膏的成分、流变特性、黏度等方面详细阐述了金属合金粉末含量、粉末尺寸、焊剂黏度、刮刀运行速度、刮刀压力、速度等方面触变性是怎样影响印刷质量的。

It analyses why the thixotropy of soldering paste affects on printing quality and in the view of several factors as the composition, thixotropy and viscosity of the paste, it introduces how metal particle content and its size, the paste viscosity, squeegee speed and pressure, paste release influence the printing quality.