丙烯基硫脲对低磷化学镀镍沉积过程的影响

INFLUENCE OF ALLYLTHIOUREA ON THE DEPOSITION PROCESS OF ELECTROESS NICKEL WITH LOW CONTENT OF PHOSPHORUS

通过电化学测量技术研究了丙烯基硫脲对低磷化学镀镍过程的影响．结果表明，丙烯基硫脲在低浓度时（＜５ｍｇ／Ｌ），通过电子转移机理加速了Ｎｉ２＋的还原过程，表现出明显的加速作用；在高浓度时（＞５ｍｇ／Ｌ），由于电极表面较厚吸附层的存在，阻碍了Ｈ２ＰＯ－２在催化表面的氧化反应。

Electrochemical measurements have been carried out to investigate the influence of allylthiourea on the deposition process of electroless nickel with low content of phosphorus. The results indicated that allylthiourea increased the deposition rate through the mechanism of electron transfer when its concentration was lower (<5mg/L), which accelerated the reduction of Ni 2+ . And the deposition process was inhibited due to the existence of thicker adsorption layer on deposition surface when its concentration was higher (>5mg/L), which inhibited the oxidation of H 2PO - 2.