摘要
采用电化学及Ｘ射线衍射法研究了硫脲在铜电极表面的吸附作用及其对铜沉积织构的影响。结果表明：硫脲在铜阴极表面的吸附遵守Ｆｒｕｍｋｉｎ吸附等温式，促进铜电沉积（１１１）晶面的择优取向，而抑制（２２０）晶面的生长。
Adsorption of thiourea on the copper electrode surface and the effects of thiourea on the cathode electrodeposition were studied by electrochemical method and X ray diffraction.The results show that the adsorption observes Frumkin adsorption isotherm equation;and the texture coefficient of (111) face is obviously increased,whereas that of (220) face is decreased.
出处
《合肥工业大学学报（自然科学版）》
CAS
CSCD
1999年第1期98-102,共5页
Journal of Hefei University of Technology：Natural Science
关键词
硫脲
铜
电沉积
吸附
织物
精炼
添加剂
thiourea,copper electrodeposition,adsorption type,texture
