自增感光敏聚酰亚胺的热失重及光固化研究

Thermogravimetric Analysis and Photocuring Mechanism of a Preimidized AutoPhotosensitive Polyimide

对一类主链上含有二苯甲酮羰基和侧烷基的新型自增感光敏聚酰亚胺（ＰＳＰＩ）的热失重行为及光固化过程进行了研究．通过红外分析（ＩＲ）和热失重分析（ＴＧＡ）对光固化过程进行了追踪，确定了光交联机理为侧烷基上的氢脱除后生成的自由基进攻二苯甲酮的羰基．此外，还讨论了曝光和热处理对ＰＳＰＩ薄膜颜色、脆性和溶解度的影响．

This paper describes the photocuring process of a new kind of autophotosensitive polyimide (PSPI) with benzophenone carbonyl groups and perdant alkyl substituents on its chain. Infrared spectroscopy(IR) and thermogravimetric analysis(TGA) results show that the ultraviolet curing is caused by subsequent crosslinking at the benzophenone carbonyl groups.The results of TGA show that this kind of autophotosensitive polyimide has excellent heatresistance. In addition, the changes of the color, the brittleness and the solubility of the PSPIs, which are influenced by ultraviolet and heat, are discussed.