摘要
随着系统频率的提高,衬底材料特性已成为影响信号走线之间串扰的一个不可忽略的因素。该文基于传输线方程和频域S参数对两平行微带线间串扰耦合进行理论分析,并结合全波3维电磁场仿真工具对具有不同介电常数和不同厚度的衬底材料进行了仿真和分析,得到了微带线在不同衬底下的电场分布,以及近端和远端串扰随频率、衬底介电常数和厚度变化的曲线。随着频率的增大,远端串扰将大于近端串扰,并且随着衬底介电常数和厚度的增加,微带线间的串扰呈现正弦上升的变化趋势。
With the increasing of system frequency,the characteristics of microstrip substrates are non-ignorable factor for affecting the crosstalk between transmission lines.This paper analyzes the crosstalk between two parallel microstrip lines based on the transmission line equations and S parameters,simulates the crosstalk with different permittivity and thickness of the substrate with 3D full-wave electromagnetic tool.The electric field distributions of microstrips with different substrates and the results of near-end and far-end crosstalks with the changing of frequency,substrate permittivity and thickness are obtained.The far-end crosstalk will be greater than the near-end crosstalk with the frequency increasing,and moreover,with the increasing of substrate permittivity and thickness,the crosstalks of microstrips will present a sine upward trend.
出处
《电子与信息学报》
EI
CSCD
北大核心
2010年第11期2768-2771,共4页
Journal of Electronics & Information Technology
基金
江苏省高校自然科学研究项目(10KJB510002)资助课题
关键词
微带线
串扰
衬底
介电常数
Microstrip
Crosstalk
Substrate
Permittivity
