超精密CMP电化学抛光试验台关键部件的设计

Design of Electrochemical Ultra-polishing Testing System and Key Components

由于化学机械抛光(CMP)中机械和化学作用同时发生在芯片抛光过程中,因此,传统的电化学测试仪难以动态测试CMP中芯片表面成膜的过程。将传统CMP设备与电化学测试分析仪相结合,开发新型电化学CMP测设平台。研究关键部件抛光头和抛光盘的设计,采用ANSYS进行传感器弹性体的标定与设计,并进行电化学分析试验的验证。结果表明开发的测试平台数据采集稳定,工作平稳,基本达到设计目标。

Since the combined effects of chemical reaction and mechanical removal occur at the same time, it is difficult to investigate the formation and component of the thin chemical film between the slurry and wafer surface. Integrated the CMP and electrochemical testing system together, a novel tester was developed. The calibration and design of the elastomer sensor were carried out by ANSYS. The tester was verified using the polishing experiments of Al wafer. It is shown that the novel ultra-polishing testing system can stably work and collect the experimental data, which achieves the designing aims.