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电镀Ag-Pd合金镀层的研究进展 被引量：1

Research Progress on Electroplating of Ag-Pd Alloy Coating
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摘要 Ag-Pd合金镀层具有良好的性能,在电子等工程领域有着广泛的应用。综述了近年来电镀Ag-Pd合金镀层的发展,重点介绍了电镀Ag-Pd合金卤化物体系及氨化合物体系脉冲电镀、离子液体电镀和光催化电镀等工艺,并展望了今后的发展趋势。 Since Ag-Pd alloy coating having excellent performances it has been widely used in engineering including electronics engineering.The development of Ag-Pd alloy electroplating in recent years was reviewed.Ag-Pd alloy plating solution such as halogenide system and ammonia compound system,Ag-Pd alloy pulse electroplating,Ag-Pd alloy coating deposition from ionic liquid and deposition under photocatalysis were mainly introduced.The development trends of Ag-Pd alloy coating electroplating were prospected as well.
作者 梁成浩 徐晶 黄乃宝 王金渠
机构地区 大连海事大学交通与物流工程学院 大连理工大学化工学院
出处 《电镀与精饰》 CAS 北大核心 2010年第11期22-26,共5页 Plating & Finishing
基金 国家高技术研究发展计划资助项目(863计划 NO.2009AA05Z120)
关键词 电镀Ag-Pd合金 脉冲电镀 离子液体电镀 光催化电镀 Ag-Pd alloy electroplating pulse electroplating ionic liquid electroplating photocatalytic electroplating
分类号 TQ153.2 [化学工程—电化学工业]
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参考文献18

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电镀与精饰
2010年 第11期

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