提高微结构表面在镀液中的润湿性

Improvement of the Surface Wettability of Microstructures in the Electrolyte

为提高微结构在氨基磺酸镍镀液中的润湿性,研究了在该镀液中加入十二烷基硫酸钠(SDS)作为润湿剂和对微结构表面进行氧等离子体改性这两种方法的效果。测试了4种含不同SDS浓度的氨基磺酸镍镀液的极化曲线。运用傅里叶变化红外光谱分析(FTIR),对不同改性时间下的光刻胶表面成分进行了表征。提出了一种表征微结构润湿情况的方法。实验证明,添加SDS不影响镍在氨基磺酸镍溶液中的析出电位。FTIR的测试结果表明,通过氧等离子体改性在光刻胶表面引入了亲水的羟基,从而增强了由光刻胶构造的微结构的润湿性。研究发现,深宽比为1、线宽为50μm的微结构阵列经过氧等离子体改性5s后,在15min之内可被含SDS0.5kg/m3的氨基磺酸镍镀液完全浸润。

The sodium dodecyl sulfate （SDS） as a wetter and O2 plasma modification was investigated to enhance the wettability of microstructures in the nickel sulfamate electrolyte. The polarization curves of the nickel sulfamate electrolytes with different SDS concentrations were tested. The surface ingredients of photoresist were characterized during different modification time periods by Fourier transform infrared spectroscopy （FTIR）. A new method was proposed to characterize the wettability of the microstructure. The experiment proves that the nickel deposition potential cannot be changed by the addition of SDS. According to the result of FTIR, the hydroxyl is introduced in the photoresist by O2 plasma modification to enhance the wettability of microstrueture. The result shows that the microstructure array with the width of 50 μm and the depth to width ratio of 1 is exposed to O2 plasma modification for 5 s, and is completely infiltrated within 15 min by nickel sulfamate electrolyte with 0.5 kg/m^3 SDS.