摘要
针对印刷电路板中BGA器件焊点缺陷检测数字化成像问题,设计了一套应用Matrox公司的MeteorII-CameraLink型号采集卡及HAWK-160XI型X-射线源和UNIQ-1800 CCD相机组成的高分辨率X-射线缺陷检测系统。经试验测试最佳放大率下系统分辨率17 lp/mm,缺陷分析精度最小分辨率达到0.03 mm,并给出测试采集效果图。
For the digital imaging problem of solder joint defect detection of BGA device in the printed circuit board,it designs a high-resolution X-ray flaw detection system,using MeteorII-CameraLink acquisition card of Matrox company,HAWK-160XI X-ray source and UNIQ-1800 CCD camera.By testing,the systemic resolution of optimal magnification achieves 17 lp/mm,the minimum resolution of defect analysis accuracy achieves 0.03 mm,and the result pictures of collection test are showed.
出处
《核电子学与探测技术》
CAS
CSCD
北大核心
2010年第10期1404-1407,共4页
Nuclear Electronics & Detection Technology
基金
四川省教育厅青年基金项目(2006B100)