摘要
为深刻了解铺层为[(±45)4/(0,90)/(±45)2]S和[(±45)/04/(0,90)/02]S层压板内孔隙的尺寸、形状及分布情况,通过改变固化压力产生不同孔隙率,采用显微图像分析方法对复合材料层压板厚度方向内孔隙的形态进行了观察,并利用图像分析软件对孔隙的形状和尺寸进行了统计分析.研究表明,对于铺层为[(±45)4/(0,90)/(±45)2]S层压板,孔隙大多出现在层间树脂富集的地方,且孔隙均会沿层间发展;对于铺层为[(±45)/04/(0,90)/02]S层压板,孔隙率较小时孔隙主要出现在层间,而当孔隙率较大时孔隙开始在层内出现,且纵横比较小.对于这两种铺层,孔隙的长度、面积和纵横比均随着孔隙率的增加而增加.
In order to have a profound understanding of the size,shape and distribution of void morphology for the [(±45)4/(0,90)/(±45)2]S and [(± 45)/04/(0,90)/02]S carbon fiber reinforced epoxy composite laminates,different void contents were obtained by applying a set of cure pressures.Microscopic image analysis was used to investigate the voids of through-the-thickness of the composite laminates.And statistical analysis of size and shape of voids was carried out by image analysis software.The results show that voids tend to locate between the plies for the [(±45)4/(0,90)/(±45)2]S laminates.For the [(±45)/04/(0,90)/02]S laminates,voids occur between the plies when the void content is low,but when the void content is high,some voids are observed to occur in the plies,and the aspect ratio of these voids is small.For the two laminates,the size,area and aspect ratio increase with the increase of void content.
出处
《材料科学与工艺》
EI
CAS
CSCD
北大核心
2010年第5期657-661,共5页
Materials Science and Technology
关键词
聚合物基复合材料
孔隙
形态
图像分析
polymer-matrix composites void morphology image analysis