期刊文献+

电场诱导微结构图形化形成机理及常温制备工艺 被引量:6

Room-Temperature Electrically Induced Micro-Structure Patterning Mechanism and Technique
下载PDF
导出
摘要 利用液体薄膜表面热扰动造成的表面张力失稳特性,提出一种常温条件下的非接触式电场诱导聚合物图形化技术.采用Navier-Stokes方程和线性稳定分析理论建立了薄膜流体的电场诱导力学模型,阐明了电场诱导过程中微结构的形成机理和周期特性,并详细分析了微结构的成长因数.采用低黏度紫外光固化型聚合物作为图形化材料,在常温条件进行了电场诱导成形实验研究,实验结果证明了电场诱导成形在常温条件下应用于紫外光固化型聚合物的可行性.在导电的掺杂硅片基底上以匀胶方式制备0.8μm厚的紫外光固化型聚合物薄膜,使用平整的导电玻璃作为无图形模板.在基底和模板间施加25 V的直流电压进行电场诱导成形实验,获得了平均中心间距为37.6μm,平均直径为24.8μm的大面积周期性柱状结构.将基底和模板间的电压提高至30 V,周期性柱状结构的中心间距降低为30.8μm,平均直径降低为18.5μm.另外,采用理论模型对诱导成形过程中的诱导时间、成形特点和图型特征等要素进行了详细的分析,并提出了获得高精度、快速电场诱导图形化的工艺参数优化方案. A non-contact electrically induced patterning technique was proposed for forming a periodic micro-structure on a polymer film at room temperature,based on the surface tension instability of liquid polymer film caused by thermal disturbance.An electro-mechanical model for the electrically induced polymer film rheology was established by using the Navier-Stokes equation and a linear stability theory to analyze the patterning dynamics,periodicity and growth factor of the micro-structure generated by the electrical field.An experiment of the electrically induced micro-patterning process at room temperature was carried out by using a low-viscosity UV curable polymer as the material for patterning.The experimental results have validated the feasibility of the electrically induced patterning with UV curable polymer at room temperature.The UV curable polymer film with a thickness of 0.8 μm was coated on the substrate of conductive doped silicon wafer and smooth conductive glass was used as flat mask.Direct current with voltage of 25 V was applied between the substrate and mask to carry out the experiment of electrically induced patterning,in which periodic pillars on large area were obtained,with the average centre to centre spacing of 37.6 μm and the average diameter of 24.8 μm.When the applied voltage was raised to 30 V,the average centre to centre spacing of periodic pillars was reduced to 30.8 μm and the average diameter of periodic pillars was reduced to 18.5 μm.Factors in the electrically induced process such as the induction time,template-to-film gap,and pattern size were analyzed in detail based on the theoretical model proposed.An approach to the process parameter optimization was suggested for achieving quick and high precision electrically induced patterning.
出处 《纳米技术与精密工程》 EI CAS CSCD 2010年第6期504-509,共6页 Nanotechnology and Precision Engineering
基金 国家重点基础研究发展计划(973计划)资助项目(2009CB724202) 国家自然科学基金重大研究计划重点支持项目(90923040)
关键词 电场诱导图形化 常温 微结构 紫外光固化型聚合物 electrically induced patterning room-temperature micro-structure UV curable polymer
  • 相关文献

参考文献12

  • 1林忠华,胡国清,刘文艳,张慧杰.微机电系统的发展及其应用[J].纳米技术与精密工程,2004,2(2):117-123. 被引量:27
  • 2葛文勋,丛鹏.微机电系统发展动向[J].纳米技术与精密工程,2007,5(3):182-189. 被引量:17
  • 3王权岱,段玉岗,卢秉恒,杨连发.MEMS压印模板制作的刻蚀机理及尺寸控制方法[J].纳米技术与精密工程,2009,7(1):90-94. 被引量:2
  • 4丁玉成,刘红忠,卢秉恒,李涤尘.下一代光刻技术——压印光刻[J].机械工程学报,2007,43(3):1-7. 被引量:13
  • 5Jiang Weitao, Ding Yucheng, Liu Hongzhong, et al. Two- step curing method for demoulding in UV nanoimprint lithography [ J ]. Microelectronic Engineering, 2008, 85 ( 2 ) : 458-464.
  • 6Liu Hongzhong, Jiang Weitao, Ding Yucheng, et al. A novel loading and demoulding process control in UV nanoimprint lithography [ J ]. Microelectronic Engineering, 2009, 86(1) : 4-9.
  • 7Schaffer E, Thurn-Albrecht T, Russell T P, et al. Electrically induced structure formation and pattern transfer [ J ]. Nature, 2000, 403: 874-877.
  • 8Deshpande P, Chou S Y. Lithographically induced self-assembly of microstructures with a liquid-filled gap between the mask and polymer surface [J]. J Vac Sci Technol B, 2001, 19(6) : 2741-2744.
  • 9欧阳帆,吴建刚,孙凯歌,岳瑞峰,刘理天.基于介质上电润湿的透射式显示器件[J].纳米技术与精密工程,2008,6(1):34-37. 被引量:4
  • 10王一平.工程电动力学[M].西安:西安电子科技大学出版社,2007.

二级参考文献69

  • 1[1]Terry S C,Herman J H,Angel J B.A gas chromatograph air analyzer fabricated on a silicon wafer[J].IEEE Trans Electron Devices,1979,ED-26 1 880.
  • 2[2]Middelhoek S,Audet S A,Silicon Sensors[M].New York:Academic Press,1989.
  • 3[3]Fluitman J.Microsystems technology:objectives [M].Sensors and Actuators,1996,A56:151-166.
  • 4[4]Hirano T.Japanese activities in micromachining [J].MST News,1995,14:14-17.
  • 5[6]上海科技在线学习[Z].http://www.stcsm.gov.cn/fuwuzhinan//ff/fa/know/mue/200107024-m-1.htm.
  • 6[15]Marc Madou.Fundamentals of Micro Fabrication [M].CRC Press,1997.
  • 7[16]Jack W Judy.Microelectromechanical systems(MEMS)fabrication,design and applications[J].J of Smart Materials and Structures,2001(10):1 115-1 134.
  • 8[20]Tong Q Y,Osele G.Semiconductor wafer bonding[J].A Wiley-Interscience Publication,1999.
  • 9[23]Boustedt K,Persson K,Stranneby D.Flip chip as an enabler for MEMS packaging [A].In:2002 Electronic Components and Technology Conference Electronic Components and Technology Conference [C].2002.
  • 10[30]MEM Technology [Z].http:// www.stcsm.gov.cn // earning/lessor/gao xin/200/0724/200/07024_m-5.asp.

共引文献61

同被引文献44

  • 1来五星,轩建平,史铁林,杨叔子.微制造光刻工艺中光刻胶性能的比较[J].半导体技术,2004,29(11):22-25. 被引量:9
  • 2张晔,陈迪,张金娅,倪智萍,朱军,刘景全.SU-8胶光刻工艺参数优化研究[J].微细加工技术,2005(3):36-41. 被引量:7
  • 3丁玉成,刘红忠,卢秉恒,李涤尘.下一代光刻技术——压印光刻[J].机械工程学报,2007,43(3):1-7. 被引量:13
  • 4刘红忠,丁玉成,卢秉恒,尹磊,蒋维涛,史永胜,邵金友.释放保型软压印光刻工艺[J].机械工程学报,2007,43(8):86-90. 被引量:4
  • 5葛文勋,丛鹏.微机电系统发展动向[J].纳米技术与精密工程,2007,5(3):182-189. 被引量:17
  • 6CHOU S Y, KRAUSS P R, RENSTROM P J. Imprint of sub-25 nm vias and trenches in polymers [J]. Applied Physics Letters, 1995, 67 (21): 3114- 3116.
  • 7SCHAFFER E, THURN-ALBRECHT T, RUSSELL T P, et al. Electrically induced structure formation and pattern transfer [J]. Nature, 2000, 403 (6772): 874-877.
  • 8WU N, RUSSEL W B. Micro- and nano-patterns created viaeleetrohydrodynamie instabilities [J]. Nano Today, 2009, 4 (2) : 180- 192.
  • 9CHOU S Y, ZHUANG L. Lithographically induced self-assembly of periodic polymer micropillar arrays [J]. Journal of Vacuum Science & Technology: B, 1999, 17 (6) : 3197- 3202.
  • 10SFERRAZZA M, XIAO C, JONES R A L, et al. Evidence for capillary waves at immiscible polymery/polymer interfaces[J]. Phisical Review Letters, 1997, 78 (19): 3693-3696.

引证文献6

二级引证文献4

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部