摘要
随着电子技术的进步,PCB(印制电路板)的复杂程度、适用范围有了飞速的发展。高速高密度是许多现代电子产品的显著发展趋势之一,高速高密度PCB设计技术成为一个重要的研究领域。文中对高频PCB设计的布线层数、布线密度、布线方向、走线长度、过孔数量等设计中需要注意的一些问题进行了研究,探讨了解决问题的方法及技巧。
With the progress of electronic technology,complexity of PCB(printed circuit board),applicable scope have development at full speed.The high density of the high speed is one of the prominent development trends of a lot of modern electronic products,the high density PCB designing technique of the high speed becomes an important research field.Wiring layer designed to high-frequency PCB in the article is counted,connect up density,connect up direction,walk line length,pass hole quantity,etc.design need some problems that notice carry on research,have probed into method and skill which solve the problem.
出处
《数字技术与应用》
2010年第10期129-130,共2页
Digital Technology & Application