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波导光互连的研究进展 被引量:3

Research Progress of Waveguide Optical Interconnection
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摘要 介绍了波导光互连的研究现状及发展趋势。波导光互连研究主要包括波导结构的成形、微反光镜的制作、功能结构的设计以及可靠性测试,应用前景广阔,是今后几年光互连技术的研究重点之一。然而波导光互连也面临着很大的挑战:廉价材料和工艺的选择,性能与可靠性的完善,互连密度的提高与可靠性的协调,3D封装以及标准化与产业化等。 Research and development of waveguide optical interconnection are described.Waveguide optical interconnection includes waveguide structure forming,process of micro-mirror structure,functional structure design and reliability test.Owning extensive application prospect,waveguide optical interconnection becomes one of the research key points for next few years.However,there still has great challenges existed,e.g.choosing of low-cost materials and processes,improvement on performance,and compromise between density-increased and reliability.The issues with 3-D packaging,industrialization and industry standardization are also need to consider further.
出处 《电子工艺技术》 2010年第6期311-314,319,共5页 Electronics Process Technology
基金 国家自然科学基金项目(项目编号:60776033)
关键词 光互连 波导 微光镜 3D封装 Optical interconnection Waveguide Micro-mirror 3 Dimensional Packaging
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参考文献16

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  • 3Nikolaos Bamiedakis, Aeffendi Hashim, et al. Low-cost PCB- integrated 10-Gb/s optical transceiver built with a novel inte- gration method[ J]. IEEE Transactions on Components, Packag- ing and Manufacturing Technology,2013,3(4) :592 - 600.
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  • 7TAO Qing, LUO Feng-guang, CAO Lei, et al. Relative power loss of misalignment based on electro-optical printed circuit board[J]. Optic,2011,122(18) :1603 - 1606.
  • 8TAO Qing, LUO Feng-guang, ZHANG Jin-xing, et al. Analysis of fabrication tolerance based on uneven thickness of SuB-pho- to-resist[ J]. Journal of Optical Technology, 2013,80 (5) : 329 -331.
  • 9Hideyuki Nasu, Kazuya Nagashim, Yozo Ishikawa. Sn-Ag-Cu solder reflow-capable 28-Gb/s x 4-channel high-density paral- lel-optical modules [ J ]. Journal of Lightwave Technology, 2013,31(24) :4111 - 4118.
  • 10张谨.基于EOPCB光互连板的光耦合研究[D].武汉,华中科技大学.2008.

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