摘要
利用润湿测量法研究了低银无铅焊料SAC0307、SAC0507和SAC0807的润湿性能,发现上述低银焊料润湿性能几乎相同。通过波峰焊接实验鉴定了其溶解铜焊盘性能,发现所做短时间溶铜实验中上述低银焊料的低银焊料的溶铜速度几乎相同。温度循环实验后检测了金属间化合物生长及裂纹发生情况,确定低银无铅焊料SAC0807裂纹萌生率最低。所作实验研究中皆采用共晶锡银焊料SAC305作为参照焊料。
The wetting properties of the low Ag lead free solders SAC0307,SAC0507,SAC0807 were investigated using the wetting balance test.It was found that the above-mentioned low Ag lead free solders showed almost the same wetting properties.The dissolution of Cu pad in these lead free solders during the short time wave soldering was tested and the dissolution rates were at the same level.The IMC growth and the crack were checked after the thermal cycling test and the SAC0807 solder showed the lowest ratio of the crack formation.The eutectic solder SAC305 was taken as the reference solder in all the above tests.
出处
《电子工艺技术》
2010年第6期320-323,368,372,共6页
Electronics Process Technology
基金
广东省科技计划项目(项目编号:2008A080403008)
广东省重大专项(项目编号:2009A080204009)
广东省粤港关键领域招标项目(项目编号:2008A092000007)
关键词
低银焊料
润湿
溶解
裂纹
low Ag solder
wet
dissolution
crack
