摘要
机电产品随着使用时间的持续增加,许多发热电子元器件需要及时散热。否则,将影响产品的正常功能。目前散热方式有:辐射散热,传导散热,对流散热和蒸发散热等,本文针对光碟机的散热垫,利用有限元分析软件ANSYS进行了传导散热的相关分析,供散热分析者学习借鉴。
With the using time increasing of electronic products,a lot of heat from the electronic devices need dispelling in time.Otherwise,this will influence the normal function of the products.The heat dissipation way is as follows: Radiation,conduct,convection and evaporation etc.This paper is focusing the heat sink of the ODD,analysis the dispelling heat by using the software ANSYS,for the heat dissipation analyst to study and use as a reference.
出处
《机电产品开发与创新》
2010年第6期64-65,共2页
Development & Innovation of Machinery & Electrical Products