在线式等离子清洗在IC封装工艺中的应用

The Application of Online Plasma Cleaning in IC Packaging Process

在IC封装工艺过程中,芯片表面的氧化物及颗粒污染物会降低产品质量,如果在封装工艺过程中的装片前、引线键合前及塑封固化前进行等离子清洗,则可有效去除这些污染物。介绍了在线式等离子清洗设备及清洗原理,并对清洗前后的效果做了对比。

In IC packaging process,the oxides and particulate pollutants on chip’s surface can reduce the quality of products. However, the plasma cleaning before the loading, wire bonding and plastic package solidifying can efficiently remove these pollutants. This paper introduces the online plasma cleaning equipment and relevant theories,and compares the effects before and after the cleaning.