摘要
对微胶囊自修复聚合物材料的修复机理、修复剂、催化剂及聚合物基体的选择等进行了阐述,并指出最新发展动态及未来发展趋势。
The mechanism of microencapsulated self-healing polymeric materials is discussed.Recent developments of self-heal systems with increased healing efficiency are introduced as well.The research trends in this area are also proposed.
出处
《宇航材料工艺》
CAS
CSCD
北大核心
2010年第1期1-4,13,共5页
Aerospace Materials & Technology
关键词
微胶囊
自修复
智能材料
聚合物材料
Microcapsules
Self-healing
Smart materials
Polymeric materials
