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430不锈钢用绝缘玻璃浆料 被引量:1

Insulanting Glass Paste for 430 Stainless Steel
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摘要 研究了一种适合430不锈钢发热器用BaO-Al2O3-SiO2-B2O3绝缘玻璃。结果表明:当BaO的质量分数在40%,SiO2在33%,Al2O3在10%,B2O3在5%,其它成分在6%时,可获得烧结温度在850~870℃,保温时间在10~15min,ρ(20℃)为3.2×1014Ω.cm,ρ(500℃)为1.07×108Ω.cm,耐压不低于2000V/80μm,膨胀系数在(8~8.5)×10-6/℃,抗热震性良好的430不锈钢用绝缘玻璃。研究了有机载体的成分与印刷厚度的关系。结果表明:采用合适的有机载体制备的绝缘介质浆料,印刷3次,烧结3次后,可获得80~90μm的印刷厚度。 A kind of BaO-Al2O3-SiO2-B2O3 insulating glass suitable for stainless steel heater was studied. The results show that a splendid insulating glass for 430 stainless steel with resistivity ρ(20℃)=3.2×1014Ω·cm, ρ(500℃)=1.07×108Ω·cm, breakdown voltage ≥2000V/80μm, thermal expansion coefficient α = (8~8.5)×10-6/℃, and excellent thermal shock resistance can be obtained, if the glass is composed of 40% BaO, 33% SiO2, 10% Al2O3, 5% B2O3,and 6% other components and sintered at 850~870℃ for 10~15min. The relationship between composition of organic carrier and printing thickness were studied. The results show that an optimum printing thickness may be achieved by using proper organic carrier.
出处 《玻璃与搪瓷》 CAS 2010年第2期11-16,共6页 Glass & Enamel
关键词 电子玻璃浆料 无铅 430不锈钢 electronic glass paste lead-free 430 stainless steel
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  • 1王承遇,陶瑛.玻璃成分的设计与调整(十六)[J].玻璃与搪瓷,2004,32(4):59-63. 被引量:1
  • 2马英仁.封接玻璃(十)──与金属封接的微晶玻璃[J].玻璃与搪瓷,1994,22(2):49-54. 被引量:10
  • 3高档妮,刘新年,郭宏伟.ZnO-B_2O_3-BaO系无铅封接玻璃析晶行为的研究[J].玻璃,2005,32(6):10-13. 被引量:3
  • 4R.Barry.Lead-free materials announced[J].Glass,1991,68(1):32 -35.
  • 5Satoru Ogihara.Environmental prescriptions and countermeasures for lead -containing glasses[J].New Glass,1998,13(3):32 -35.
  • 6作花济夫.玻璃手册[J].北京:建筑工业出版社,1985.92-93.
  • 7R.Morena.Phosphate glasses as alternatives to Pb -based sealing frits[J].J.Non-Cryst.Solids,2000,263-264:382 -387.
  • 8R.M.莫伦纳.用于阴极射线管的熔封和封接材料[P].CN Patent:95 103 974.1,1995-11-22.
  • 9Ide,Akira.Lead-free sealing glass for ignition plugs[J].JP Patent:2 004 018 335,2004-01-22.
  • 10Ide,Akira.Lead-free sealing glass and sealing compositions containing same for display panels[P].JP Patent:2 004 035 316,2004 -02 -05.

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