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PCB的电磁兼容设计 被引量:5

EMC Design of PCB
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摘要 文章基于对电磁兼容(EMC)的介绍,主要研究了电子设备载体印刷电路板的设计过程中的几点注意事项,研究的重点为走线方式、接地、分割、旁路和去耦以及天线效应。 Based on electromagnetic compatibility(EMC) of introduction,this article researches for electronic equipment carrier PCB design process,and some issues requiring attention for the research of layout,grounding,segmentation,and the bypass and decoupling antenna effect.
出处 《印制电路信息》 2010年第12期9-12,共4页 Printed Circuit Information
关键词 印制电路板 电磁兼容(EMC) 电磁干扰(EMI) 电磁敏感性(EMS) PCB electromagnetic compatibility(EMC) electromagnetic interference(EMI) electromagnetic susceptibility(EMS)
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参考文献8

  • 1Printed Circuit Board Design Techniques for EMC Compliance Broadcom Corporation.
  • 2王定华,赵家升.电磁兼容原理与设计[MI.北京:电子科技大学出版社.
  • 3刘小宁.PCB的电磁兼容设计[J].科技信息,2009(7):68-68. 被引量:5
  • 4W.M. King: EMCT-Electromagnetic Compatibility Tutorial, produced by Elliott Laboratories, Sunnyvale, CA and IEEEStandards. Information Network.
  • 5D.M.Hockanson, J.L.Drewniak, T.H.Hubing, T.P.Van Doren, F.Sha, C.-W. Lam, and L.Rubin: Quantifying EMI.
  • 6Resulting from Finite-Impedance Reference Planes, IEEE Transaction on EMC, Vol. 39, Nov. 1997.
  • 7Marco Leone: Design Expressions tot the Trace- to-Edge Common-Mode Inductance of a Printed Circuit Board, IEEE. Trans. on EMC, vol.43, no. 4, November 2001.
  • 8J. Lockwood, E. Pavlu, US Patent 5,898,576 "Printed Circuit Board Including a Terminated Power Plane and Method of Manufacturing the Same", April 1999.

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