摘要
针对多层陶瓷电容器在电镀过程电镀锡铅效果差的问题,利用扫描电子显微镜和能谱仪分析了正常和变差样品银层的微观结构,其结果表明:电镀效果差的样品端电极银层表面出现较大面积的缺损,部分内部介质裸露,影响了后期电镀时银层的导电性,导致电镀效果变差。
Aimed at the problem of tin-lead plating in multilayer ceramic capacitors devices,the microstructure and components of Silver termination are studied with SEM and EDS,and the failure modes occurred in the outer-electrode are documented.The results show that appear larger defects in the silver electrode layer surface in samples of electroplating effect poor,part inside medium nudity,affecting late plating conductivity,lead electroplating effect worse.
出处
《印制电路信息》
2010年第12期53-54,58,共3页
Printed Circuit Information
关键词
多层陶瓷电容器
银层
电镀
MLCC
Silver termination
Electroplating
