期刊文献+

镀膜装置蒸发源发射形态与膜厚分布 被引量:4

Emission form of evaporator sources for coating system and film thickness distribution
下载PDF
导出
摘要 蒸发源是真空镀膜装置中一个非常重要的部件。在多个蒸发源共存的装置中,如何在设计中正确选择蒸发源与蒸发源、蒸发源与基片之间的距离就显得尤为重要,它直接关系到基板涂层均匀性。本篇文章根据蒸发源与基片之间的物理联系入手,分析基片--蒸发源距离对基片涂层均匀性的影响,进而对蒸发源与蒸发源、蒸发源与基片之间距离的确定,提出了自己的一些观点和看法。 Evaporator source is integral to a vacuum coating system.For a coating system involving several evaporator sources,how to choose the distances between different sources and between the sources and substrate are very important in design,since they relate directly to the homogeneity of coating on substrate.In view of the physical relation between evaporator source and substrate,the effect of the source-substrate distance on coating homogeneity is analyzed so as to determine the distances between different sources and between the sources and substrate.Some suggestions are offered in this regard.
出处 《真空》 CAS 北大核心 2010年第6期23-25,共3页 Vacuum
关键词 真空镀膜 基片 蒸发源 距离 vacuum coating substrate evaporation source distance
  • 相关文献

参考文献1

  • 1王福贞,等.表面沉积技术[M].北京:机械工业出版社,1989.

同被引文献33

引证文献4

二级引证文献2

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部