摘要
高度集成、小型化使得微型芯片的热流密度越来越高,需要寻找一种高效的散热方式来解决芯片的热问题。射流冲击冷却对于局部散热效果甚好,文中基于空气对热源的射流冲击原理,针对电子设备的芯片散热设计了空气射流冷板,对影响冷板换热系数的主要因素进行了模拟计算,优化了设计模型,并对两种冲击孔径的冷板试验件进行了试验研究。
The heat flux density of micro-electronics chips is more and more high,because of integration and miniaturization,so a high efficient technology is needed to solve the thermal management issues of micro-electronics chips.Spray cooling effect to heat-transfer of the part is very efficiency.A radiator of spray cooling with air is designed,based on the theory of spray cooling,used in heat-transfer of chips on the circuit board.Several factors of spray cooling is presented,and the radiator is simulated and optimized by FLUENT.Finally,two different impingement diameter radiators of spray cooling with air are tested and analysed.
出处
《电子机械工程》
2010年第6期17-19,共3页
Electro-Mechanical Engineering
关键词
空气射流冷板
换热系数
模型优化
试验分析
a radiator of spray cooling with air
heat-transfer coefficient
model optimized
experiment and analysis
