低温真空下Cu-Cu界面间接触热阻的实验研究

EXPERIMENTAL RESEARCH ON THE THERMAL CONTACT RESISTANCE BETWEEN Cu-Cu IN VACUUM AND LOW TEMPERATURE

简单介绍了低温真空下固体界面间的接触热阻现象，搭建了一个能较精确测量圆柱型及薄片型材料间接触热阻的实验台。在真空环境下，测量了低温真空下Ｃｕ－Ｃｕ界面间的接触热阻。实验数据表明，接触热阻与压力、温度有着一定的依赖关系。最后，根据修正Ｇ一Ｗ模型，对实验结果进行了理论分析与比较，表明实验结果是正确的。

In this paper The phenomena of thermal Contact Resistance (TCR) at the interface between solid was analyzed simply and an experimental used to measure the TCR betweenthe cylinder or thin disk samples was set up with high accuracy. In vacuum and low temperature,the TCR between Cu and Cu has been measured. The experimental data indicated that the TCRdepends on the applied pressure and the interface temperature. The logarithm of the measuredTCR was proportional to the logarithm of the applied pressure. At last, using the modified G-Wmodel, the experimental results was analyzed and compared with predicated results. This ascertains that the experimental results are correct.