摘要
建立适当模型对微波功率放大器芯片的单个晶体管进行温度分析,仿真结果表明,最高温度高于晶体管正常工作温度。从封装上采取措施,对芯片-粘接材料-基板这一基本结构进行分析,最后解决了温度过高问题。
In this paper, we do the thermal analysis of the transistors and the chip using the Ansys software. It finds that the maximum temperature is higher than the safely working temperature. Then analyze the chip-adhesive material-substrate structure in the ANSYS environment. In the end, we solve the problem that the chip can＇t work normally because of the high temperature. We mainly consider the chip-adhesive layer - substrate heat conduction path in the analysis process.
出处
《电子技术应用》
北大核心
2010年第12期48-50,共3页
Application of Electronic Technique
