热等离子体技术:现状及发展方向

THERMAL PLASMA TECHNOLOGY: WHERE DO WE STAND AND WHERE ARE WE GOING?

试图从以下４个方面对热等离子体材料加工现在以及将来的研究与发展进行评价：（１）热等离子体涂镀技术；（２）热等离子体微细粉末合成；（３）热等离子体处理废物；（４）热等离子体球化及致密化．一般来讲，由于热等离子体加工由大量参数决定，实行控制非常必要．在某些情况下，缺乏足够的控制以及经济方面的一些不利因素是热等离子体技术成长的主要障碍．但是。

In this overview, an attempt is made to assess the present and future research and development in thermal plasma processing of materials restricted to (1) thermal plasma coating technologies, (2)thermal plasma synthesis of fine powders, (3) thermal plasma waste destruction, and (4) thermal plasma spheroidization and densification.Sine thermal plasma processing is, in general, governed by a large number of parameters, implementation of controls becomes mandatory. The lack of sufficient controls combined with economic drawbacks in some cases has been the main obstacle for the growth of thermal plasma technology. Present R&D efforts, however, address these problems.