摘要
文章基于对波导结构的分析,提出了一种大功率合路器的设计。波导结构标准的E面T型结能够对功率进行分配/合成,但其枝节的端口响应及枝节间的隔离使得其无法直接用于功率合成/分配。将溅射薄膜电阻后的陶瓷基片引入T型结中,并对T型结的枝节段进行尺寸优化,得到一个端口匹配且隔离度良好的合路器。基于对波导特性、匹配网络理论的分析,设计了一个覆盖Ka频段的功率合路器。
A high power combiner is proposed with the analyses of waveguide.Standard E plane T-junction of waveguide can distribute/combine power,but it can not be directly used for combining/distributing because of port response and isolation of branches.After adding in ceramic substrate of sputtering thin-film resistance and optimizing branch sizes,a combiner of port match and good isolation is obtained.Based on the analyses of waveguide and matching networks,a power combiner of Ka-band is designed.
出处
《空间电子技术》
2010年第4期67-70,共4页
Space Electronic Technology
关键词
大功率
合路器
隔离
宽带匹配
High Power Combining structure Isolation Matching network
