提高小功率白光LED热特性的新方法

New method to improve the thermal characteristics of low-power white LED

在传统直插式LED封装方法的基础上,提出了一种在环氧树脂中添加氮化硼(BN)填料的改进LED封装工艺。测量了BN填料质量分数与导热系数的关系,利用有限元分析软件ANSYS分析和实验测试了采用改进封装工艺φ5 mm白光LED的芯片结温、热阻等参数,并与传统封装方法的白光LED进行比较。结果表明:采用改进封装结构φ5 mm白光LED结温比传统封装方法下降4.5℃,热阻下降了17.8%,同时提高了初始光通量,降低了光衰。

On the base of traditional packaging technique of through-hole LED,an improved packaging using epoxy resin doped with BN filler was presented.Thermal conductivity of epoxy resin doped with different mass fractions of BN filler was studied.Through thermal analysis based on ANSYS software forφ5 mm white LED,the junction temperature and heat resistance of improved packaging were compared with those of white LED prapared by traditional packaging technique.The result shows that the improved packaging ？5 mm white LED＇s junction temperature decreases by 4.5 ℃,and its heat resistance is 17.8% less than tradition ones,meanwhile,the initial flux increases,the light weakening reduces.