摘要
对国内外室温固化耐温胶粘剂的研究现状进行了综述。重点介绍了几种可室温固化的有机胶粘剂,包括环氧树脂胶粘剂、有机硅胶胶粘剂以及它们的改性产品,简述了无机胶粘剂在室温固化和高温使用方面的情况。提出了室温固化高温型胶粘剂今后的研究和发展方向。
The research prograss of heat-resistant adhesive cured at room temperature is reviewed in this essay. Several kinds of organic adhesives such as epoxy resin adhesive （EP） and organosilieon adhesive are introduced and some inorganic adhesives are involved. In the end, the development trends of the adhesive are put forward.
出处
《材料开发与应用》
CAS
2010年第6期88-93,共6页
Development and Application of Materials
关键词
室温固化
耐热性
胶粘剂
EP
Cured at room temperature
Heat-resistant
Adhesive
EP
