LED封装中热沉及热电制冷器材料的研究进展

Research progress on heatsink and thermoelectric devices materials applied in the LED packaging

在深刻分析热沉和热电制冷散热机理的基础上,结合国内外学者对两种散热器件的理论分析,详细描述了热沉及热电制冷器应用于LED封装上的研究进展.通过建立理论热模型及运用数值模拟的方法,研究材料因素对散热性能的影响.在材料的应用上,对热沉中的Al/SiC材料及热电制冷器中的PbTe晶体材料进行实验研究.指出热沉及热电制冷器的优化不仅要考虑内部材料和几何形状,更要考虑热沉、热电制冷器和风扇等外部组合情况.

Based on the study of the principle of the heatsink and the thermoelectric device,the intensive analysis of the cooling principle of heatsink and thermoelectric refrigeration and theory of these two cooling devices,progress in research of heatsink and thermoelectric device applied in LED packaging is described in detail. The theoretic thermal models are built and the numerical simulation method is utilized to evaluate the cooling performance of heatsink and thermoelectric device mainly due to the material factor. For the material application research,the performance of Al/SiC heatsink and the PbTe crystal thermoelectric device are analyzed by the experiment method. It is pointed out that not only the factors of interior material and geometric shape should be considered for the optimization of heatsink and thermoelectric device but also the combination ways of heatsink,thermoelectric device and fan.