摘要
印制电路板的可焊性镀锡常采用热浸Sn-Pb合金工艺,不符合清洁生产要求。为此,研究了一种甲基磺酸盐化学镀锡工艺,探索了镀液中主盐、配位剂、还原剂、防氧化剂、表面活性剂等组分对化学镀锡层性能的影响。研究结果表明,在优化的工艺条件下可获得厚度0.8～2.0μm、可焊性优良的银白色锡镀层,该工艺可替代传统的印制电路板热浸Sn-Pb合金热风整平工艺(HASL)。
The technology for electroless tin plating of printed circuit boards in a methylsulfonate bath was established to replace commonly used hot-dipping process of Sn-Pb alloy coating.The effects of major salt,complexing agent,reducing agent,antioxidant and surfactant in plating bath on the properties of electroless Sn coating were investigated.It was found that argenteous electroless Sn coating with a thickness of 0.8~2.0 μm and good weldability was obtained under the optimized plating condition.Resultant electroless Sn coating could be used to replace hot-dipped Sn-Pb alloy coating of printed circuit boards obtained by hot air solder leveling (HASL) technology.
出处
《材料保护》
CAS
CSCD
北大核心
2010年第12期39-41,共3页
Materials Protection
关键词
化学镀锡
甲基磺酸盐
印制电路板
可焊性
electroless tin plating
methylsulfonate
printed circuit board
weldability
