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座椅塑件开裂问题的解决

Solution of Cracking Problem on Injection Molded Chair Parts
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摘要 针对某座椅塑件的开裂问题,通过Moldflow软件模拟分析,发现塑件在原始工艺条件下呈现一定的向下挠度翘曲,最大可达1.6 mm,又经量化得出塑件厚侧边的磨砂皮纹对塑件的摩擦力可大于14 kN,推知工艺条件和模具结构是导致塑件开裂的原因,并通过优化工艺参数和改变原始模具结构,使问题得到解决。 For the cracking problem of chair parts, it was found that the injection molded parts naa the downward deflection warpage under the original conditions by the simulation analysis of Moldflow. The largest warpage reached 1.6mm. A quantitative calculation showed that the frictional force between the injection molded parts was greater than 14 kN. It was deduced that the process conditions and mould structure factor were the reason of cracks on the injection molded parts. Finally, by optimizing process parameters and changing the original mould structure, the problem was solved.
出处 《中国塑料》 CAS CSCD 北大核心 2010年第12期77-79,共3页 China Plastics
关键词 座椅塑件 开裂 MOLDFLOW 模具结构 injection molded chair part crack Moldflow mould structure
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  • 1董斌斌,申长雨,李倩.注射成型薄壁制品收缩与翘曲因素[J].化工学报,2005,56(4):727-731. 被引量:25
  • 2阳湘安.手机电池盖的CAE翘曲变形分析[J].模具技术,2005(5):38-40. 被引量:1
  • 3范云霄,武迎迎,赵国强,王方凯.基于MPI的塑件浇口优化设计[J].模具工业,2006,32(12):53-56. 被引量:13
  • 4赖鹏,彭响方,陈己明.Moldflow冷却分析在注塑模中的应用[J].塑料工业,2007,35(6):29-31. 被引量:27
  • 5Balofusji H.. Plastics Product Design and Process Engineering[M]. Beijing: Chemical Industry Press,2000. 10.
  • 6Rheinfeld D.. Injection Molding Technology[M]. Beijing: China Light Industry Press, 1990.50 60.
  • 7Zoetelief W. F. , Douven L. F. A. , Ingenhousz A. J.. Residual Thermal Stresses in Injection Molded Products [J]. Polymer Engineering and Science, 1996, 36 (14): 1 886 1 896.
  • 8Rezayat M. , Stafford R. O.. A Thermoviscoelastic Model for Residual Stress in Injection Molded Thermoplastics [J]. Polymer Engineering and Science, 1991, :31 (6) : 393- 398.
  • 9Lee B. H. , Kim B. H.. Optimization of Part Wall Thickness to Reduce Warpage of Injection Molded Part Based on the Modified Complex Method[J]. Polymer-plastics Tech nology and Engineering, 1995, 34 (5):793-811.
  • 10Subremanian N. R. , Lin Tingyu, Yak Aik Seng. Optimizing Warpage Analysis for An Optical Housing [ J]. Mechatronics, 2005, (15) : 111-127.

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