摘要
从元器件、基板和焊料等材料膨胀系数的匹配问题入手,对由于膨胀系数不匹配所造成的产品生产过程中的质量隐患,及其对产品工作可靠性的影响进行了分析。结合分析结果,提出了针对该问题的设计和工艺措施。
In this paper,the quality problems due to the CTE mismatching of components,substrates and solders in the process and its effect on the operational reliability of the product are analyzed.The design and processing actions for solving the problems are presented based on the analysis result.
出处
《电子产品可靠性与环境试验》
2010年第6期32-36,共5页
Electronic Product Reliability and Environmental Testing
关键词
元器件
膨胀系数
失配
可靠性
component
coefficient of temperature expansion（CTE）
mismatching
reliability
