摘要
结合了混合集成电路(HIC)破坏性物理分析(DPA)的全过程,通过对DPA各项试验的特点进行分析,从而对DPA标准中规定的一些要求和难点问题进行了补充说明,尤其对一些试验如X射线检查、多余物检测、键合强度和扫描电子显微镜检查等的具体实施方法提出了独特的见解。
By analyzing the features of various tests in the process of destructive physical analysis（DPA）of hybrid integrated circuits（HIC）,some requirements and problems in the DPA standards are discussed.A unique view on the practical implementation of X-ray inspection,remainders detection,bonding strength and SEM inspection is presented.
出处
《电子产品可靠性与环境试验》
2010年第6期37-41,共5页
Electronic Product Reliability and Environmental Testing
关键词
混合集成电路
破坏性物理分析
质量
检验
hybrid integrated circuit
destructive physical analysis
quality
testing
