摘要
高厚度铝基板是一种特殊印制板,其具有良好的尺寸稳定性和导热性,逐渐被应用于军用设备和高科技民品领域,文章对高厚度铝基板的加工工艺进行了探讨,并对生产过程存在的问题进行分析并找出改进措施。
The high thickness aluminum based board is a kind of special printed-circuit board, which has good performance in size stability and heat conduction, and been gradually used in the field of military equipment and high-tech civil products. Here, the author discusses the processing technology of high thickness aluminum based board, analyses the problems existed in producing and gets the improvement measures.
出处
《印制电路信息》
2011年第1期54-56,共3页
Printed Circuit Information
关键词
高厚度铝基微带印制电路板
加工工艺
钻孔
外形机械加工
High thickness aluminum base micro strip printed-circuit board
processing technology
hole drilling
contour processing
contour machining
