摘要
Study of electron drift velocity caused by E ×B motion is done with the help of a Mach probe in a dc cylindrical magnetron sputtering system at different plasma discharge parameters like discharge voltage, gas pressure and applied magnetic field strength. The interplay of the electron drift with the different discharge parameters has been investi- gated. Strong radial variation of the electron drift velocity is observed and is found to be maximum near the cathode and it decreases slowly with the increase of radial distance from the cathode. The sheath electric field, E measured experimentally from potential profile curve using an emissive probe is contributed to the observed radial variation of the electron drift velocity. The measured values of the drift velocities are also compared with the values from the con- ventionM theory using the experimental values of electric and magnetic fields. This study of the drift velocity variation is helpful in providing a useful insight for determining the discharge conditions and parameters for sputter deposition of thin film.
Study of electron drift velocity caused by E ×B motion is done with the help of a Mach probe in a dc cylindrical magnetron sputtering system at different plasma discharge parameters like discharge voltage, gas pressure and applied magnetic field strength. The interplay of the electron drift with the different discharge parameters has been investi- gated. Strong radial variation of the electron drift velocity is observed and is found to be maximum near the cathode and it decreases slowly with the increase of radial distance from the cathode. The sheath electric field, E measured experimentally from potential profile curve using an emissive probe is contributed to the observed radial variation of the electron drift velocity. The measured values of the drift velocities are also compared with the values from the con- ventionM theory using the experimental values of electric and magnetic fields. This study of the drift velocity variation is helpful in providing a useful insight for determining the discharge conditions and parameters for sputter deposition of thin film.
基金
Project supported by the Council of Scientific and Industrial Research-Senior Research Fellowship,Government of India grant(Award No.9/835(6)/2008/EMR-I)
