摘要
This paper designs a 3 × 3 light emitting diode （LED） array with a total power of 9 W, presents a thermal analysis of plate fin, in-line and staggered pin fin heat sinks for a high power LED lighting system, and develops a 3D one-fourth finite element （FE） model to predict the system temperature distribution. Three kinds of heat sinks are compared under the same conditions. It is found that LED chip junction temperature is 48.978℃ when the fins of heat sink are aligned alternately.
This paper designs a 3 × 3 light emitting diode （LED） array with a total power of 9 W, presents a thermal analysis of plate fin, in-line and staggered pin fin heat sinks for a high power LED lighting system, and develops a 3D one-fourth finite element （FE） model to predict the system temperature distribution. Three kinds of heat sinks are compared under the same conditions. It is found that LED chip junction temperature is 48.978℃ when the fins of heat sink are aligned alternately.
基金
Project supported by the National Natural Science Foundation of China(No.60666002)
