期刊文献+

Thermal design for the high-power LED lamp 被引量:1

Thermal design for the high-power LED lamp
原文传递
导出
摘要 This paper summarizes different kinds of heat sinks on the market for high power LED lamps. Analysis is made on the thermal model of LED, PCB and heat sink separately with a simplified mode provided. Two examples of simulation are illustrated as a demonstration for the thermal simulation as guidance for LED lamp design. This paper summarizes different kinds of heat sinks on the market for high power LED lamps. Analysis is made on the thermal model of LED, PCB and heat sink separately with a simplified mode provided. Two examples of simulation are illustrated as a demonstration for the thermal simulation as guidance for LED lamp design.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2011年第1期61-64,共4页 半导体学报(英文版)
关键词 high power LED LED lamp lamp body (heat sink) thermal simulation high power LED LED lamp lamp body (heat sink) thermal simulation
  • 相关文献

参考文献3

  • 1Narendran N, Deng L, Pysar R M, et al. Performance characteristics of high-power light-emitting diodes. Proceedings of SPIE Third International Conference on Solid State Lighting. Vol. 5187. Edited by Ferguson I T, Narendran N, DenBaars S P, et al. International Society for Optical Engineering, San Diege, Calif. 2003.
  • 2Tao W S. Numerical heat transfer. 2nd ed. Xi'an Jiaotong University Press, 2001.
  • 3Yang S M, Tao W S. Heat transfer. 3rd ed. Textbook Series for 21st Century, 1998.

同被引文献15

  • 1左育春.发光二极管(LED)组成的大功率照明灯风冷散热方式的研究[J].照明工程学报,2009,20(S1):135-137. 被引量:4
  • 2管春,何丰.MCPCB结构对LED发热的影响[J].灯与照明,2005,29(3):52-53. 被引量:3
  • 3Chiang S. The thermal driven mode [ C ]//4th Packaging, Assembly Conference. 2009. analysis of sequential LED International Microsystems, and Circuits Technology.
  • 4Christensen A, Graham S. Thermal effects in packaging high power light emitting diode arrays[J]. Appl. Thermal Engineering, 2009,29 (2/3) : 364-371.
  • 5杨振中,马忠良.基于石墨导热介质的新型LED室内灯具散热系统[R].郑州:河南省科学技术协会,2009:25-30.
  • 6Yang L,Jang S, Hwang W, et al. Thermal analysis of high power GaN-based LEDs with ceramic package [J]. Thermochimica Acta, 2007, 455(1/2) : 95-99.
  • 7Liu S,Yang J, Gan Z, et al. Structural optimization of a microjet based cooling system for high power LEDs[J]. International Journal of Thermal Sciences, 2008, 47(8): 1086-1095.
  • 8吕家东.一种新的LED制冷方案一微通道致冷器[J].光像与照明,2007(1):28-30.
  • 9Lu X Y,Hua T C, Liu M J, et al. Thermal analysis of loop heat pipe used for high-power LED [ J]. Thermoehimiea Aeta, 2009, 493(1/2): 25-29.
  • 10Kim L,Choi J H, Jang S H, et al. Thermal analysis of LED array system with heat pipe [ J ]. Thermochimica Aeta, 2007, 455(1/2) : 21-25.

引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部