填料长径比对导电胶渗流阈值的影响

Influence of slenderness ratio on the percolation threshold of conductive adhesives

采用微波辅助乙二醇还原法制备了不同长径比的银纳米方块及银纳米线,并对其进行了SEM、XRD表征。以不同长径比银纳米线作为导电填料制备了各向同性导电胶。对导电胶的填充渗流阈值的研究发现,填料的长径比对填充渗流阈值的影响很大,长径比越大,渗流阈值越小。运用修正的阈值理论对这一实验现象进行了合理解释,模拟结果表明修正的阈值理论与实验结果非常吻合。

Nanostructured silver with different slenderness ratio was prepared by a microwave（MW） assisted method.The nano-silvers were characterized by scanning electron microscope（SEM） and X-ray diffraction（XRD）.Isotropical conductive adhesive（ICA） was prepared by using the different slenderness ratio nano-silver as the conductive filler.The conductivity of the adhesive was measured by four-points method.The results indicate that the slenderness ratio of the nano-silver has important influence on it＇s percolation threshold.A feasible modified threshold theory was put forward to simulate the relationship between ratio and threshold.The simulation results agree well with the experimental results.