Sn-Pb-RE钎料的塑性变形抗力研究

Study on Plastic Deformation Resistance of SnPbRE Solder

利用拉伸实验方法研究了室温下ＳｎＰｂＲＥ钎料的塑性变形抗力。钎料的变形抗力随稀土含量的增加而提高。稀土的加入使钎料组织均匀细化，导致位垒硬化和多滑移硬化作用增强；同时，稀土存在晶界偏聚，牵制了晶界的运动，因此提高了钎料的变形抗力。此外，由于稀土化合物较硬。

The plastic deformation of solder joint depends on plastic deformation resistance of solder. The study on plastic deformation resistance of SnPbRE solder at room temperature shows that the plastic deformation resistance of SnPbRE solder enhances along with the increase of RE content. The microstructure investigation reveals that the addition of RE can make the microstructure of solder fine and homogenous, so that the barrier hardening and multisliding hardening can be enhanced. Moreover, RE on grain boundaries hinders grain boundary sliding. Therefore, the deformation resistance of solder enhances. However, since it is very hard, the intermetallic compounds of RE near fracture surface will cause intergranular cracks around it.