摘要
在添加复合添加剂(CeCl3+KI)的条件下进行化学镀镍。用扫描电镜(SEM)、X射线衍射(XRD)、动电位极化测量和电化学阻抗谱,研究了复合添加剂对镀层的影响。结果表明:复合添加剂可使镀层更加致密和均匀,腐蚀电流密度减小,电荷转移阻力增大,镀层的耐蚀性提高。
The electroless nickel plating was carried out with a composite additive consisting of CeCl3 and KI. The effect of the composite additive on deposit was studied by scanning electron microscopy (SEM), X-ray diffraction (XRD), potentiodynamic polarization measurement and electrochemical impedance spectroscopy (EIS). The results showed that the composite additive makes the deposit more compact and uniform, decreased the corrosion current density, and increases the charge transfer resistance. Therefore, the corrosion resistance of deposit is improved.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2011年第1期27-29,共3页
Electroplating & Finishing
关键词
化学镀镍
氯化铈
碘化钾
添加剂
耐蚀性
electroless nickel plating
cerium chloride
potassium iodide
additive
corrosion resistance