摘要
分析了大功率LED的热阻特性,结果表明不同厚度和热导系数的粘接材料热阻不同,而不同热阻的粘接材料对于LED热特性的实际影响一直缺乏有效的测量手段。采用热像仪拍摄热图的方法对粘接材料对LED热特性的影响进行了测试,测试结果表明热像仪成像可以作为大功率LED热特性测试评价的有效手段。
The thermal resistance of high-power LED was analyzed. It is shown that adhesive materials with various thicknesses and thermal conductivities have different thermal resistance, but their effects on the thermal property of LED can not be measured efficiently with common instruments. In this paper, the effects of adhesive materials were measured with infrared thermal imager, and test results indicate that thermal imagers can be used as an efficient method for measuring the thermal property of high-power LEDs.
出处
《半导体光电》
CAS
CSCD
北大核心
2010年第6期838-841,共4页
Semiconductor Optoelectronics
基金
佛山市科技发展专项资金项目(200603003)
关键词
大功率LED
热像仪
热阻
high-power LED
infrared thermal imager
thermal resistance
