摘要
The reactive Sn63Pb37 spreading on patterned film structures was examined in a reducing atmosphere （H2 5%＋Ar 95%）. Liquid solder spreading was observed to follow the wheel pattern made of Au/Cu thin film. At the center, a liquid cap was formed around the hub by viscous spreading of the liquid front. Ahead of the main viscous flow front, a liquid film was found to be extended on thin Au-Cu lines at a fast rate to a great distance by rapid Sn-Au chemical reaction.
The reactive Sn63Pb37 spreading on patterned film structures was examined in a reducing atmosphere （H2 5%＋Ar 95%）. Liquid solder spreading was observed to follow the wheel pattern made of Au/Cu thin film. At the center, a liquid cap was formed around the hub by viscous spreading of the liquid front. Ahead of the main viscous flow front, a liquid film was found to be extended on thin Au-Cu lines at a fast rate to a great distance by rapid Sn-Au chemical reaction.
基金
supported by the National Nat-ural Science Foundation of China (No.50501022)
the National Basic Research Program of China (No.2004CB619306)
