摘要
首先介绍叠层封装技术的发展现状及最新发展趋势,然后采用最传统的两层叠层封装结构进行分析,包括描述两层叠层封装的基本结构和细化两层叠层封装技术的SMT组装工艺流程。最后重点介绍了目前国际上存在并投入使用的六类主要的叠层封装方式范例,同时进一步分析了叠层封装中出现的翘曲现象以及温度对翘曲现象的影响。分析结果表明:由于材料属性不同会引起正负两种翘曲现象;从室温升高到150℃左右的时候易发生正变形的翘曲现象,在150℃升高至260℃的回流焊温度过程中多发生负变形的翘曲现象。
The development status and latest trends of PoP are introduced.The traditional PoP solution is analyzed,which consists of the logic processor in the bottom package and memory device stack in the top package.The surface mount（SMT） assembly process flow of PoP is described.Several patents about PoP technology are shown.The warpage of the top and bottom PoP relative to each other becomes critical in impacting board mount yields and adoption.Further the effect of the relative warpage of the top and bottom PoP on SMT yields during PoP assembly is reviewed.The results show that the positive or negative warping phenomenon is due to the different material properties.Second,the positive warping phenomenon is caused when the temperature increases from 25 ℃ to 150 ℃,and the negative warping phenomenon is caused when the temperature increases from 150 ℃ to 260 ℃.
出处
《半导体技术》
CAS
CSCD
北大核心
2011年第2期161-164,共4页
Semiconductor Technology
基金
国家自然科学基金(600866002)
广西制造系统与先进制造技术重点实验室主任课题基金(0842006018_Z)
广西区研究生科研创新项目(2010105950802M07)
关键词
叠层封装
3D封装
翘曲
材料属性
回流焊
package on package（PoP）
3D package
warpage
material properties
reflow soldering
