期刊文献+

PECVD法制备纳米硅薄膜材料 被引量:3

Fabrication and application of nanometer silicon thin film material
下载PDF
导出
摘要 采用等离子增强化学汽相淀积(PECVD) 法制备了纳米硅薄膜材料, 研究了工艺参数, 如衬底温度、衬底直流偏压、反应气体流量比等对薄膜性能的影响。 ELECTRONIC COMPONENTS & MATERIALS (China), Vol 18, No 5, P 1 2 (Oct 1999) In Chinese The nc Si thin film material is deposited by plasma enhanced chemical vapor deposition (PECVD) The effects of depositing technique parameters, such as substrate temperature, substrate DC bias voltage, RF power, depositing time, flow rate ratio of reactive gases on the characteristics of nc Si thin film are investigated A new application of nc Si thin film is introduced (4 refs )
出处 《电子元件与材料》 CAS CSCD 1999年第5期1-2,共2页 Electronic Components And Materials
关键词 纳米硅薄膜材料 衬底直流偏压 PECVD法 制备 nc Si thin film PECVD substrate bias voltage gas flow rate
  • 相关文献

参考文献4

  • 1Won Chel Choi,Appl Phys Lett,1997年,70卷,22期,3014页
  • 2Hu G Y,J Appl Phys,1995年,78卷,6期,3945页
  • 3Liu Xiangna,Appl Phys Lett,1994年,64卷,2期,220页
  • 4He Yuliang,J Appl Phys,1994年,75卷,2期,797页

同被引文献15

  • 1唐作华,陈建设,孙泽民,田安民,鄢国森.SiH_3NO_2-SiH_3ONO异构化的量子化学研究[J].高等学校化学学报,1995,16(5):761-764. 被引量:3
  • 2戴国梁,王永成,耿志远,吕玲玲,王冬梅.SiH_3与NO_2反应机理的理论研究[J].Chinese Journal of Chemical Physics,2005,18(4):522-526. 被引量:3
  • 3杨颙,张为俊,裴世鑫,邵杰,黄伟,高晓明.N(^4S)+CH3X(X=Cl、Br)反应机理的理论研究[J].Chinese Journal of Chemical Physics,2005,18(6):908-912. 被引量:1
  • 4Robert W, Quandt, John F, et al. Kinetics of the SiH3+O2 and SiH3 +NO2 reactions[J]. Chemical Physics Letters, 1993, B206: 355-360.
  • 5Sengupta D, Nguyen M. Ab initio calculations and quantum statistical analysis of the SiH3 + NO reactions [J]. Chemical Physics Letters, 1997,B265: 35-40.
  • 6Sugawara K, Nakanaga T, Takeo H, et al. Rate constant measurements for reactions of SiH3 with O2, NO and NO2 using time-resolved infrared diode laser spectroscopy [J]. Chemical Physics Letters,1989, B157: 309-314.
  • 7Packwood T J, Page M. Theoretical characterization of the potential energy surface for the reaction of SiH3with NO2. Nitrosilane, silylnitrite, and the nitronitrite rearrangement[J]. Chemical Physics Letters,1993, B216: 180-188.
  • 8Slagle I R, Bernhardt J R, Gutman D. Kinetics of the reactions of SiH3 with O2 and N2 O[J]. Chemical Physics Letters, 1988, B149:180-184.
  • 9EVANS J T.An experimental 512-bit nonvotatile memory with ferroelectric storage cell[J].IEEE J Solid State Circuits,1988,23(5):1 17l-1 185.
  • 10彭英才,何宇亮.纳米硅薄膜研究的最新进展[J].稀有金属,1999,23(1):42-55. 被引量:21

引证文献3

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部