摘要
采用等离子增强化学汽相淀积(PECVD) 法制备了纳米硅薄膜材料, 研究了工艺参数, 如衬底温度、衬底直流偏压、反应气体流量比等对薄膜性能的影响。
ELECTRONIC COMPONENTS & MATERIALS (China), Vol 18, No 5, P 1 2 (Oct 1999) In Chinese The nc Si thin film material is deposited by plasma enhanced chemical vapor deposition (PECVD) The effects of depositing technique parameters, such as substrate temperature, substrate DC bias voltage, RF power, depositing time, flow rate ratio of reactive gases on the characteristics of nc Si thin film are investigated A new application of nc Si thin film is introduced (4 refs )
出处
《电子元件与材料》
CAS
CSCD
1999年第5期1-2,共2页
Electronic Components And Materials